Invention Grant
- Patent Title: Coil electronic component
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Application No.: US16008847Application Date: 2018-06-14
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Publication No.: US11211194B2Publication Date: 2021-12-28
- Inventor: Sang Kyun Kwon , Han Wool Ryu , Young Il Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0133905 20171016
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F17/00 ; H01F27/28 ; H01F27/29 ; H01F1/147 ; H01F41/04 ; H01F41/12 ; H01F27/24 ; H01F17/04
Abstract:
A coil electronic component includes a body having a coil portion embedded therein, and external electrodes connected to the coil portion, wherein the body includes a plurality of magnetic portions having a form in which magnetic particles are dispersed in an insulator and one or more insulating portions disposed between the plurality of magnetic portions.
Public/Granted literature
- US20190115146A1 COIL ELECTRONIC COMPONENT Public/Granted day:2019-04-18
Information query
