Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US16707051Application Date: 2019-12-09
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Publication No.: US11211281B2Publication Date: 2021-12-28
- Inventor: Kenji Sekiguchi
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2018-230872 20181210
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/687 ; H01L21/67 ; H01L21/02 ; H01L21/306
Abstract:
A substrate processing apparatus includes a placing unit, a supply, an embankment and a moving mechanism. The placing unit is configured to place a substrate thereon. The supply is configured to supply a processing liquid onto the substrate placed on the placing unit. The embankment is disposed to surround the substrate placed on the placing unit to suppress an outflow of the processing liquid supplied onto the substrate from the substrate. The moving mechanism is configured to vary a height of the embankment.
Public/Granted literature
- US20200185261A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2020-06-11
Information query
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