A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes first dies, an insulating encapsulation laterally encapsulating the first dies, a second die disposed over the portion of the insulating encapsulation and at least partially overlapping the first dies, and a redistribution structure disposed on the insulating encapsulation and electrically connected to the first dies and the second die. A second active surface of the second die faces toward first active surfaces of the first dies. The redistribution structure includes a first conductive via disposed proximal to the first dies, and a second conductive via disposed proximal to the second die. The first and second conductive vias are electrically coupled and disposed in a region of the redistribution structure between the second die and one of the first dies. The first conductive via is staggered from the second conductive via by a lateral offset.