Invention Grant
- Patent Title: Service module for SIP devices
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Application No.: US16293130Application Date: 2019-03-05
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Publication No.: US11211369B2Publication Date: 2021-12-28
- Inventor: Masood Murtuza , Gene Alan Frantz
- Applicant: OCTAVO SYSTEMS LLC
- Applicant Address: US TX Sugar Land
- Assignee: OCTAVO SYSTEMS LLC
- Current Assignee: OCTAVO SYSTEMS LLC
- Current Assignee Address: US TX Sugar Land
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L23/498 ; H01L23/538 ; H01L23/31 ; G01R31/28 ; H01L25/00 ; G06F30/34
Abstract:
The present disclosure describes a service module for a System in a Package (SiP) device. This includes methods of manufacture, use, and testing relating to the same.
Public/Granted literature
- US20190273073A1 SERVICE MODULE FOR SIP DEVICES Public/Granted day:2019-09-05
Information query
IPC分类:
