Invention Grant
- Patent Title: Silicon carbide device with trench gate structure and method of manufacturing
-
Application No.: US16832653Application Date: 2020-03-27
-
Publication No.: US11211468B2Publication Date: 2021-12-28
- Inventor: Ralf Siemieniec , Wolfgang Jantscher , David Kammerlander
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102019108062.2 20190328
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L21/04 ; H01L29/16 ; H01L29/78 ; H01L29/10

Abstract:
A silicon carbide device includes a silicon carbide body with a trench gate structure that extends from a first surface into the silicon carbide body. A body region is in contact with an active sidewall of the trench gate structure. A source region is in contact with the active sidewall and located between the body region and the first surface. The body region includes a first body portion directly below the source region and distant from the active sidewall. In at least one horizontal plane parallel to the first surface, a dopant concentration in the first body portion is at least 150% of a reference dopant concentration in the body region at the active sidewall and a horizontal extension of the first body portion is at least 20% of a total horizontal extension of the body region.
Public/Granted literature
- US20200312979A1 Silicon Carbide Device with Trench Gate Structure and Method of Manufacturing Public/Granted day:2020-10-01
Information query
IPC分类: