Invention Grant
- Patent Title: Hybrid and thinned millimeter-wave antenna solutions
-
Application No.: US16638567Application Date: 2018-09-28
-
Publication No.: US11211688B2Publication Date: 2021-12-28
- Inventor: Omer Asaf , Nir Weisman , Naftali Landsberg , Eyal Goldberger , Pablo Herrero , Harry G. Skinner
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2018/053268 WO 20180928
- International Announcement: WO2019/070509 WO 20190411
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q21/06 ; H01Q1/24 ; H01Q1/52 ; H01Q9/04

Abstract:
Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.
Public/Granted literature
- US20200220249A1 HYBRID AND THINNED MILLIMETER-WAVE ANTENNA SOLUTIONS Public/Granted day:2020-07-09
Information query