Invention Grant
- Patent Title: Array antenna apparatus and method for fabricating same
-
Application No.: US16486856Application Date: 2018-03-08
-
Publication No.: US11211710B2Publication Date: 2021-12-28
- Inventor: Yoichi Kitamura , Takumi Nagamine , Takayuki Nakao , Kiyoshi Ishida , Tetsu Owada
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JPJP2017-052554 20170317
- International Application: PCT/JP2018/009020 WO 20180308
- International Announcement: WO2018/168648 WO 20180920
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q9/04 ; H01Q1/22 ; H01Q21/06 ; H01Q23/00 ; H05K1/18 ; H05K3/34

Abstract:
In an array antenna apparatus, a first height of top faces of plurality of antenna elements is greater than or equal to a second height of a first top of a first electronic component relative to a first primary surface. The first electronic component is the tallest among one or more electronic components mounted on fourth primary surfaces of one or more first external circuit boards. A third height of a second primary surface is greater than a fourth height of fourth primary surfaces. Accordingly, the array antenna apparatus has good antenna characteristics.
Public/Granted literature
- US20200235478A1 Array Antenna Apparatus and Method For Fabricating Same Public/Granted day:2020-07-23
Information query