Invention Grant
- Patent Title: FPGA chip with distributed multifunctional layer structure
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Application No.: US16769061Application Date: 2018-01-08
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Publication No.: US11211933B2Publication Date: 2021-12-28
- Inventor: Chengli Liu , Haili Wang , Zixian Chen , Ming Ma
- Applicant: HERCULES MICROELECTRONICS CO., LTD.
- Applicant Address: CN Beijing
- Assignee: HERCULES MICROELECTRONICS CO., LTD.
- Current Assignee: HERCULES MICROELECTRONICS CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: CN201711332437.5 20171213
- International Application: PCT/CN2018/071736 WO 20180108
- International Announcement: WO2019/114070 WO 20190620
- Main IPC: H03K19/17736
- IPC: H03K19/17736 ; H03K19/17796

Abstract:
An FPGA chip includes one functional unit, one pre-allocation manager, and wiring segments. The functional unit includes a first module CPE and a second module PLF. The pre-allocation manager may be connected by means of one of the wiring segments. By configuring one pre-allocation manager, data transmission directions of the wiring segments may be changed. The functional unit is connected to one pre-allocation manager by means of a conventional line. The first module CPE and the second module PLF which are adjacent in the same functional unit are connected by means of a cross-connection line. The second functional modules are interconnected by means of a conventional routing system. Different functional blocks can be connected to each other from any position of a circuit.
Public/Granted literature
- US20210234545A1 FPGA CHIP WITH DISTRIBUTED MULTIFUNCTIONAL LAYER STRUCTURE Public/Granted day:2021-07-29
Information query
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