Invention Grant
- Patent Title: Implantable sensor
-
Application No.: US15249248Application Date: 2016-08-26
-
Publication No.: US11213254B2Publication Date: 2022-01-04
- Inventor: Stefan Schibli , Jens Troetzschel , Thomas Doerge , Murad Abu Asal
- Applicant: Heraeus Deutschland GmbH & Co. KG
- Applicant Address: DE Hanau
- Assignee: Heraeus Deutschland GmbH & Co. KG
- Current Assignee: Heraeus Deutschland GmbH & Co. KG
- Current Assignee Address: DE Hanau
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: EP15182859 20150828
- Main IPC: A61B5/00
- IPC: A61B5/00 ; A61B5/0215 ; A61B5/03 ; A61B5/01 ; A61B3/16 ; A61B5/07 ; A61B5/11 ; A61B90/00

Abstract:
An implantable sensor is proposed including a ring shaped element and a coil. The ring shaped element is made of a silicone and is electrically conductive. The coil may be formed by a wire with a number of windings, wherein at least the free ends of the wire are enclosed by the silicone of the ring shaped element, wherein an electrical resistance of the ring shaped element varies upon a deformation of the ring shaped element.
Public/Granted literature
- US20170055909A1 IMPLANTABLE SENSOR Public/Granted day:2017-03-02
Information query