Invention Grant
- Patent Title: Resin composition for resin composite, resin composite, and refrigeration device comprising the said resin composite
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Application No.: US16583396Application Date: 2019-09-26
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Publication No.: US11214668B2Publication Date: 2022-01-04
- Inventor: Hung-Jui Kuo , Jui-Hsi Hsu , Chen-Pao Huang
- Applicant: Chi Mei Corporation
- Applicant Address: TW Tainan
- Assignee: Chi Mei Corporation
- Current Assignee: Chi Mei Corporation
- Current Assignee Address: TW Tainan
- Agency: Bacon & Thomas, PLLC
- Priority: TW107136522 20181017
- Main IPC: C08L9/06
- IPC: C08L9/06 ; C08L51/04 ; C08L25/12 ; F25D23/08 ; B32B27/30 ; C08L55/02 ; C08K7/02 ; C08K5/01

Abstract:
A resin composite is provided, which comprises: a first resin layer including a first rubber modified styrene-based resin composition; and a second resin layer including a second rubber modified styrene-based resin composition. The first and second rubber modified styrene-based resin compositions respectively comprise: a styrene-based copolymer; and rubber particles. In the first rubber modified styrene-based resin composition, on the basis of a total weight of all monomer units of the styrene-based copolymer being 100 wt %, the styrene-based copolymer comprises more than or equal to 21.0 wt % to less than or equal to 31.0 wt % of an acrylonitrile-based monomer unit. In the second rubber modified styrene-based resin composition, on the basis of a total weight of all monomer units of the styrene-based copolymer being 100 wt %, the styrene-based copolymer comprises more than or equal to 12.0 wt % to less than 21.0 wt % of an acrylonitrile-based monomer unit.
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