Invention Grant
- Patent Title: Resin composition for semiconductor package, prepreg and metal clad laminate using the same
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Application No.: US16334201Application Date: 2018-03-08
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Publication No.: US11214677B2Publication Date: 2022-01-04
- Inventor: Chang Bo Shim , Hee Yong Shim , Hyun Sung Min , Young Chan Kim , Seung Hyun Song
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2017-0036104 20170322,KR10-2018-0018018 20180213
- International Application: PCT/KR2018/002779 WO 20180308
- International Announcement: WO2018/174446 WO 20180927
- Main IPC: C08L63/00
- IPC: C08L63/00 ; B32B15/14 ; C08J5/24 ; H01L23/14 ; H01L23/498 ; H01L23/00 ; C08K3/013 ; C08K5/17 ; C08K9/06 ; C08K5/00 ; C08K3/36
Abstract:
The present invention relates to a resin composition having a high flow property, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.
Public/Granted literature
- US20190276661A1 RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG AND METAL CLAD LAMINATE USING THE SAME Public/Granted day:2019-09-12
Information query
