Provided is a film forming apparatus for forming a metal film, capable of uniformly pressurizing a substrate surface with an electrolyte membrane subjected to the fluid pressure of an electrolytic solution containing metal ions during film formation even when an insoluble anode is used. A housing of the apparatus includes a partition member between the anode and the electrolyte membrane, for partitioning a housing chamber into first and second housing chambers. The partition member includes a porous body impregnated with cation exchange resin. The first housing chamber houses the anode insoluble in a first electrolytic solution. The second housing chamber has formed therein a hermetically sealed space in which a second electrolytic solution containing metal ions is enclosed within the housing, by the electrolyte membrane and the partition member. The apparatus is also provided with a pump (pressure unit) that pressurizes the second electrolytic solution in the second housing chamber.