Invention Grant
- Patent Title: Heat pump
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Application No.: US16667645Application Date: 2019-10-29
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Publication No.: US11215370B2Publication Date: 2022-01-04
- Inventor: Hideshi Okada , Norihiro Okuda , Tomoya Yoshimura
- Applicant: Yanmar Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Yanmar Co., Ltd.
- Current Assignee: Yanmar Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Norton Rose Fulbright US LLP
- Priority: JP2014-237145 20141121
- Main IPC: F24F1/16
- IPC: F24F1/16 ; F25B43/02 ; F25B45/00 ; F25B31/00 ; F25B13/00 ; F24F1/10 ; F02M21/02 ; F04B39/02

Abstract:
A heat pump system includes a first heat pump and a second heat pump. The first heat pump includes a first outdoor unit. The first outdoor unit includes a compressor, an outdoor-unit connecting pipe, and a refrigerant filling port. The outdoor-unit connecting pipe connects an intake path of the compressor and a second outdoor unit of the second heat pump for supplying a refrigerant to the second outdoor unit of the second heat pump. The refrigerant filling port is provided in a portion of the outdoor-unit connecting pipe.
Public/Granted literature
- US20200063987A1 Heat Pump Public/Granted day:2020-02-27
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