Invention Grant
- Patent Title: Probe card, semiconductor measuring device, and semiconductor measuring system
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Application No.: US16757761Application Date: 2017-11-16
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Publication No.: US11215639B2Publication Date: 2022-01-04
- Inventor: Hiroto Matsubayashi , Takayuki Matsumoto , Tomoaki Nakamura
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2017/041278 WO 20171116
- International Announcement: WO2019/097629 WO 20190523
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R1/073 ; G01R31/26
Abstract:
A probe card has an edge sensor. The edge sensor has a first needle and a second needle. The first needle and the second needle are in contact with each other when the first needle and a wafer are not in contact with each other, and the first needle and the second needle are not in contact with each other when the first needle and the wafer are in contact with each other. The probe card has a resistor connected between the first needle and the second needle.
Public/Granted literature
- US20210140998A1 PROBE CARD, SEMICONDUCTOR MEASURING DEVICE, AND SEMICONDUCTOR MEASURING SYSTEM Public/Granted day:2021-05-13
Information query
