Techniques and mechanisms for mitigating damage to voltage regulator (VR) circuitry of a packaged device. In an embodiment, the VR circuitry comprises a circuit leg between a first node and a second node. During a burn-in process, the VR circuitry provides a regulated output voltage to a load circuit via the first node, wherein the output voltage is based on a supply voltage received via the second node. While the VR circuitry provides the regulated output voltage to the load circuit, a supply current is provided to the load circuit via a path which is independent of any leg which is between the first node and the second node. In another embodiment, an integrated circuit (IC) chip of the packaged device comprises the load circuit, and the leg further comprises an off-chip coil structure which is distinct from the IC chip.