Invention Grant
- Patent Title: Semiconductor device manufacturing system, and semiconductor device manufacturing method
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Application No.: US17015967Application Date: 2020-09-09
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Publication No.: US11215931B2Publication Date: 2022-01-04
- Inventor: Masakazu Hamasaki
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2020-044628 20200313
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H01L21/027

Abstract:
According to one embodiment, there is provided a semiconductor device manufacturing system, including a storage unit, a specifying unit, a determination unit and an adjustment unit. The storage unit stores device information indicating a relationship between image formation performance of an exposure device used for manufacturing a semiconductor device and mechanical operation accuracy. The specifying unit specifies a constraint of the mechanical operation accuracy according to the device information and the required image formation performance. The determination unit determines whether or not a correction parameter of an exposure condition satisfies the constraint. The adjustment unit adjusts the correction parameter according to a determination result of the determination unit.
Public/Granted literature
- US20210286271A1 SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2021-09-16
Information query
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