Invention Grant
- Patent Title: Force sensing module and method of manufacturing the same and electronic device
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Application No.: US17017767Application Date: 2020-09-11
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Publication No.: US11216143B1Publication Date: 2022-01-04
- Inventor: Lien Hsin Lee , Ren Hung Wang , Wei Yi Lin , Fengming Lin , Wen Shan Cheng , Ming Hsien Ko , Yan Zhao , Tai Shih Cheng
- Applicant: TPK Touch Solutions (Xiamen) Inc.
- Applicant Address: CN Fujian
- Assignee: TPK Touch Solutions (Xiamen) Inc.
- Current Assignee: TPK Touch Solutions (Xiamen) Inc.
- Current Assignee Address: CN Fujian
- Agency: Cooper Legal Group, LLC
- Priority: CN202010547927.2 20200616
- Main IPC: G06F3/045
- IPC: G06F3/045 ; G06F3/041

Abstract:
A force sensing module includes a first transparent electrode, a second transparent electrode, and a light-transmitting force-sensitive composite layer. The light-transmitting force-sensitive composite layer includes at least one light-transmitting electrode layer and at least one functional spacer layer. The light-transmitting electrode layer has a first resistivity. The functional spacer layer has a second resistivity greater than the first resistivity. The light-transmitting electrode layer and the functional spacer layer are stacked between the first transparent electrode and the second transparent electrode. The light-transmitting force-sensitive composite layer has an optical transmittance greater than 85% and a haze less than 3%.
Public/Granted literature
- US20210389835A1 FORCE SENSING MODULE AND METHOD OF MANUFACTURING THE SAME AND ELECTRONIC DEVICE Public/Granted day:2021-12-16
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