Invention Grant
- Patent Title: Multi-die and multi-core computing platform and booting method for the same
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Application No.: US16923244Application Date: 2020-07-08
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Publication No.: US11216282B2Publication Date: 2022-01-04
- Inventor: Qunchao Feng , Yankui Niu , Jinglong Liu , Yongfeng Song , Jiangbo Wang , Jintao Wang
- Applicant: Shanghai Zhaoxin Semiconductor Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: Shanghai Zhaoxin Semiconductor Co., Ltd.
- Current Assignee: Shanghai Zhaoxin Semiconductor Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: McClure, Qualey & Rodack, LLP
- Priority: CN201910976671.4 20191015
- Main IPC: G06F9/4401
- IPC: G06F9/4401 ; G06F13/362

Abstract:
A booting technology for a multi-die and multi-core computing platform is shown. A storage device stores number 1 firmware code and number 0 firmware code. A master die is coupled to the storage device through a bus and accesses the number 1 firmware code from the storage device through the bus. A first slave die is also coupled to the storage device through the bus. However, instead of accessing the storage device for the number 1 firmware code, the first slave die monitors the bus and retrieves the number 1 firmware code, accessed by the master die, from the bus. The master die further accesses the number 0 firmware code from the storage device through the bus. The master die executes the number 0 firmware code to operate the master die and the first slave die to boot the system and start up the platform.
Public/Granted literature
- US20210109762A1 MULTI-DIE AND MULTI-CORE COMPUTING PLATFORM AND BOOTING METHOD FOR THE SAME Public/Granted day:2021-04-15
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