Invention Grant
- Patent Title: Automotive sensor integration module 100
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Application No.: US16726717Application Date: 2019-12-24
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Publication No.: US11216703B2Publication Date: 2022-01-04
- Inventor: Sang Hun Lee , Seung Bum Lee
- Applicant: HYUNDAI MOBIS CO., LTD.
- Applicant Address: KR Seoul
- Assignee: HYUNDAI MOBIS CO., LTD.
- Current Assignee: HYUNDAI MOBIS CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2019-0133134 20191024
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06K9/62 ; H04L29/08 ; H04Q9/04 ; G01S13/86 ; G01S13/931 ; G01S7/40

Abstract:
An automotive sensor integration module including a plurality of sensors which differ in at least one of a sensing period or an output data format, and a signal processing unit configured to synchronize, when a malfunctioning sensor is detected from among the plurality of sensors, pieces of detection data output from remaining sensors other than the detected sensor to substantially simultaneously output the synchronized data as sensing data.
Public/Granted literature
- US20210125009A1 AUTOMOTIVE SENSOR INTEGRATION MODULE 100 Public/Granted day:2021-04-29
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