Invention Grant
- Patent Title: Coil component
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Application No.: US16032745Application Date: 2018-07-11
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Publication No.: US11217372B2Publication Date: 2022-01-04
- Inventor: Min Ki Jung , Hee Soo Yoon , Sang Jong Lee , Seung Hee Hong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0156356 20171122
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F5/04 ; H01F27/29 ; H01F27/28 ; H01F17/00

Abstract:
A coil component includes a body including an internal coil and including an upper surface and a lower surface opposing each other in a thickness direction thereof; a first external electrode connected to one end of the internal coil; and a second external electrode connected to the other end of the internal coil. The first external electrode and the second external electrode may be formed on the same one side portion of the lower surface of the body.
Public/Granted literature
- US20190156977A1 COIL COMPONENT Public/Granted day:2019-05-23
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