- Patent Title: Inductive assembly and method of manufacturing inductive assembly
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Application No.: US16467235Application Date: 2017-11-30
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Publication No.: US11217378B2Publication Date: 2022-01-04
- Inventor: Nicolas Degrenne
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: EP17305175 20170216
- International Application: PCT/JP2017/043891 WO 20171130
- International Announcement: WO2018/150694 WO 20180823
- Main IPC: H01F5/04
- IPC: H01F5/04 ; H01F5/06 ; H01F27/02 ; H01F3/08 ; H01F17/00 ; H01F27/30 ; H05K1/18 ; H01F5/00 ; H01F27/06

Abstract:
An inductive assembly includes: a support with an open channel having a straight portion with a bottom surface and two side surfaces, a foldable PCB such that to cover at least a part of the bottom surface and the side surfaces, the PCB having a plurality of tracks, each track being electrically continuous between a pair of connecting spots, a magnetic piece which can be accommodated into the channel equipped with the PCB. The PCB is arranged to surround at least partially a portion of the magnetic piece in the folded state in the channel such that at least one connecting spot of a first track is electrically connected to a connecting spot of a second track to form a winding around the magnetic piece and to inductively couple the PCB and the magnetic piece.
Public/Granted literature
- US20200075216A1 INDUCTIVE ASSEMBLY AND METHOD OF MANUFACTURING INDUCTIVE ASSEMBLY Public/Granted day:2020-03-05
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