Invention Grant
- Patent Title: Semiconductor device and method of manufacturing same
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Application No.: US16587197Application Date: 2019-09-30
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Publication No.: US11217449B2Publication Date: 2022-01-04
- Inventor: Tomohide Terashima , Yasuhiro Kagawa , Kensuke Taguchi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2018-239386 20181221
- Main IPC: H01L21/22
- IPC: H01L21/22 ; H01L29/10 ; H01L29/16 ; H01L29/32 ; H01L29/78 ; H01L29/66 ; H01L29/739

Abstract:
There is provided a technique for suppressing the operation of a parasitic transistor in a semiconductor device having a voltage sense structure. The semiconductor device includes: a semiconductor layer; a first impurity region; a second impurity region; a first semiconductor region; a second semiconductor region; a first electrode; a second electrode; and a third electrode. The second impurity region includes a low lifetime region at least under the second semiconductor region. The low lifetime region is a region having a defect density higher than that in a surface layer of the second impurity region or a region in which a heavy metal is diffused.
Public/Granted literature
- US11183386B2 Semiconductor device and method of manufacturing same Public/Granted day:2021-11-23
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