Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US16737526Application Date: 2020-01-08
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Publication No.: US11217451B2Publication Date: 2022-01-04
- Inventor: Hitoshi Kosugi , Shota Umezaki , Kouzou Tachibana , Ryo Yamamoto
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2019-006171 20190117
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/687 ; H01L21/67

Abstract:
A method includes rotating a substrate, supplying a first processing liquid from a first nozzle to the substrate during a first period, and supplying a second processing liquid from a second nozzle to the substrate during a second period. First and second liquid columns are formed by the first and second processing liquids during at least partially overlapped period of the first and second periods, respectively. The shapes and arrangements of the first and second liquid columns satisfy that: at least one of first and second central axis lines of the first and second liquid columns is inclined with respect to a rotational axis line of the substrate, first and second cut surfaces obtained by cutting the first and second liquid columns along a horizontal plane at least partially overlap each other, and any point on the first central axis line is located on the second central axis line.
Public/Granted literature
- US20200234998A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2020-07-23
Information query
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