Invention Grant
- Patent Title: Substrate processing device
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Application No.: US16323537Application Date: 2017-07-27
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Publication No.: US11217461B2Publication Date: 2022-01-04
- Inventor: Ayumi Higuchi
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JPJP2016-193249 20160930
- International Application: PCT/JP2017/027228 WO 20170727
- International Announcement: WO2018/061445 WO 20180405
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/3213 ; H01L21/306 ; H01L21/304

Abstract:
An object is to quickly regenerate metal ion removal capability of a substrate processing device. To achieve the object, a substrate processing device includes a processing unit, a supply tank and a collection tank. The processing unit performs etching processing on a substrate by using a treatment solution from a first circulation path. The used treatment solution is guided to the collection tank, and circulates in a second circulation path. The second circulation path includes a first partial pipe and a second partial pipe, and a metal removal coating including metal capturing groups for removing metal ions in the treatment solution is applied to an inner wall of the first partial pipe. An acid-based chemical solution is supplied to the first partial pipe from the acid-based chemical solution supply unit, so that metal adsorption force of the metal capturing groups is regenerated.
Public/Granted literature
- US20190198356A1 SUBSTRATE PROCESSING DEVICE Public/Granted day:2019-06-27
Information query
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