Invention Grant
- Patent Title: Substrate treatment apparatus
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Application No.: US16199699Application Date: 2018-11-26
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Publication No.: US11217468B2Publication Date: 2022-01-04
- Inventor: Hikaru Akada
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JPJP2017-233621 20171205
- Main IPC: H01L21/677
- IPC: H01L21/677 ; G03F7/09 ; H01L21/67 ; H05K5/02 ; H05K7/18 ; H05K7/16 ; H01R4/50

Abstract:
A substrate treatment apparatus for treating a substrate, the substrate treatment apparatus includes: an apparatus main body configured to perform a predetermined treatment on the substrate; a casing configured to house a predetermined component therein and to be attachable to and detachable from an upper part of the apparatus main body; a casing side connection part provided at the casing and connected to the predetermined component; a main body side connection part provided at the upper part of the apparatus main body and configured to be fitted into the casing side connection part; a guide part provided at the upper part of the apparatus main body and configured to move the casing in one direction; and a connection assisting mechanism configured to fit the casing side connection part into the main body side connection part while moving the casing in the one direction.
Public/Granted literature
Information query
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