Invention Grant
- Patent Title: Non-vacuum, non-contact spinner wafer chuck
-
Application No.: US16705798Application Date: 2019-12-06
-
Publication No.: US11217474B2Publication Date: 2022-01-04
- Inventor: Glenn Emerson Holland
- Applicant: Government of the United States of America, as represented by the Secretary of Commerce
- Applicant Address: US MD Gaithersburg
- Assignee: Government of the United States of America, as represented by the Secretary of Commerce
- Current Assignee: Government of the United States of America, as represented by the Secretary of Commerce
- Current Assignee Address: US MD Gaithersburg
- Agency: Office of Chief Counsel for National Institute of Standards and Technology
- Main IPC: H01L21/687
- IPC: H01L21/687

Abstract:
A non-vacuum, non-contact spinner wafer chuck including: a basal member including; a fastener receiver that receives a fastener; a chuck collar including: an inner collar wall; and an outer collar wall; and an engagement surface that: receives and engages a wafer; a wafer engagement cam including: an engagement face that engages the wafer; an index cam disposed on the chuck collar and comprising: an index face that faces toward the fastener receiver and that engages the wafer; and a spinner engager disposed on the spinner-side surface of the basal member and comprising: a spinner arm receiver bounded by a wall and that receives a spinner of the wafer processing machine, wherein the wafer engagement cam and the index cam engage the wafer and maintains an orientation of the wafer with respect to the index cam in response to rotation of the wafer relative to the non-vacuum, non-contact spinner wafer chuck.
Public/Granted literature
- US20210175114A1 NON-VACUUM, NON-CONTACT SPINNER WAFER CHUCK Public/Granted day:2021-06-10
Information query
IPC分类: