Invention Grant
- Patent Title: Manufacturing method of CMOS inverter
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Application No.: US16758051Application Date: 2020-01-07
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Publication No.: US11217489B1Publication Date: 2022-01-04
- Inventor: Huafei Xie , Shujhih Chen , Chiayu Lee
- Applicant: TCL China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: TCL China Star Optoelectronics Technology Co., Ltd.
- Current Assignee: TCL China Star Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN201911349982.4 20191224
- International Application: PCT/CN2020/070613 WO 20200107
- International Announcement: WO2021/128467 WO 20210701
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L29/66 ; H01L21/02 ; H01L27/28 ; H01L51/00

Abstract:
The present disclosure provides a manufacturing method of a complementary metal-oxide-semiconductor (CMOS) inverter includes annealing a substrate printed with an oxide ink to obtain a first active layer, printing a carbon tube ink between a first source and the first drain to form a second active layer for obtaining a first thin-film transistor (TFT), forming a second source and a second drain on two sides of the first active layer to obtain a second TFT, and forming wires between the first TFT and the second TFT.
Public/Granted literature
- US20210408269A1 MANUFACTURING METHOD OF CMOS INVERTER Public/Granted day:2021-12-30
Information query
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