Invention Grant
- Patent Title: Heat exchanger for electronics
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Application No.: US16566068Application Date: 2019-09-10
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Publication No.: US11217505B2Publication Date: 2022-01-04
- Inventor: Scott D. Brandenburg , Mark W. Hudson
- Applicant: Aptiv Technologies Limited
- Applicant Address: BB St. Michael
- Assignee: Aptiv Technologies Limited
- Current Assignee: Aptiv Technologies Limited
- Current Assignee Address: BB St. Michael
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/373

Abstract:
An electronics heat exchanger including a fluid flow body having a first panel, a second panel, and at least one fluid flow guide connecting the first panel and the second panel, a plurality of pedestals extending from the second panel, the plurality of pedestals including at least a first pedestal having a first height and a second pedestal having a second height, distinct from the first height, and wherein each of the pedestals is integral with the second panel.
Public/Granted literature
- US20210074605A1 HEAT EXCHANGER FOR ELECTRONICS Public/Granted day:2021-03-11
Information query
IPC分类: