A semiconductor package according to an aspect includes a package substrate, a first semiconductor chip disposed on the package substrate and including a first through electrode, a second semiconductor chip stacked on the first semiconductor chip and having a second through electrode, and a nonconductive film disposed in a bonding zone between the first semiconductor chip and the second semiconductor chip. At an edge portion of the bonding zone, an edge portion of the first semiconductor chip is recessed in the lateral direction, based on an edge portion of the second semiconductor chip.