A manufacturing method of a chip package structure is provided. A carrier board with an accommodating cavity, a substrate, and a stainless steel layer sputtered on the substrate is disposed. A chip is disposed in the accommodating cavity of the carrier board. The chip has an active surface, a back surface opposite to the active surface, and multiple electrodes disposed on the active surface. A circuit structure layer is formed on the carrier board. The circuit structure layer includes a patterned circuit and multiple conductive vias. The patterned circuit is electrically connected to the electrodes of the chip through the conductive vias. An encapsulant is formed to cover the active surface of the chip and the circuit structure layer. The active surface of the chip and a bottom surface of the encapsulant are coplanar. The carrier board is removed to expose the chip disposed in the accommodating cavity.