A transfer method and a transfer device of micro LEDs are provided. By horizontally and vertically stretching a tensile substrate evenly to make horizontal distances and vertical distances between the adjacent micro LEDs achieve predetermined target values, and at last, bonding the micro LEDs spaced apart into the target values to an array substrate. The method does not need to manufacture a patterned mold or a patterned transfer head, and production period is reduced, and production cost is lowered, which effectively improves current transfer methods of the micro LEDs.