Invention Grant
- Patent Title: Direct application additive manufacturing for conductive wafer interconnect
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Application No.: US16751681Application Date: 2020-01-24
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Publication No.: US11217659B1Publication Date: 2022-01-04
- Inventor: Matthew W. Barlow , Nicholas J. Chiolino , Anthony M. Francis , James A. Holmes
- Applicant: Matthew W. Barlow , Nicholas J. Chiolino , Anthony M. Francis , James A. Holmes
- Applicant Address: US AR Springdale; US AR Springdale; US AR Elkins; US AR Fayetteville
- Assignee: Matthew W. Barlow,Nicholas J. Chiolino,Anthony M. Francis,James A. Holmes
- Current Assignee: Matthew W. Barlow,Nicholas J. Chiolino,Anthony M. Francis,James A. Holmes
- Current Assignee Address: US AR Springdale; US AR Springdale; US AR Elkins; US AR Fayetteville
- Agency: Keisling & Pieper PLC
- Agent David B. Pieper; Trent C. Keisling
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G01L9/00 ; H01L49/02 ; H01L21/66 ; H01L27/144 ; H01L51/00 ; H01L21/768
Abstract:
An improved silicon carbide wafer using direct application conductive ink interconnects positioned on printing connection pads. The conductive ink interconnected can be routed to form a custom length resistive trace for a device after fabrication and measurement of the device.
Information query
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