Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US16750847Application Date: 2020-01-23
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Publication No.: US11217674B2Publication Date: 2022-01-04
- Inventor: Yuki Nakano
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C
- Priority: JP2013-030018 20130219
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/16 ; H01L29/20 ; H01L29/10

Abstract:
A semiconductor device of the present invention includes a gate electrode buried in a gate trench of a first conductivity-type semiconductor layer, a first conductivity-type source region, a second conductivity-type channel region, and a first conductivity-type drain region formed in the semiconductor layer, a second trench selectively formed in a source portion defined in a manner containing the source region in the surface of the semiconductor layer, a trench buried portion buried in the second trench, a second conductivity-type channel contact region selectively disposed at a position higher than that of a bottom portion of the second trench in the source portion, and electrically connected with the channel region, and a surface metal layer disposed on the source portion, and electrically connected to the source region and the channel contact region.
Public/Granted literature
- US20200161441A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANURACTURING THE SAME Public/Granted day:2020-05-21
Information query
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