Invention Grant
- Patent Title: Semiconductor device and method
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Application No.: US16837554Application Date: 2020-04-01
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Publication No.: US11217679B2Publication Date: 2022-01-04
- Inventor: Chien-Chih Lin , Yen-Ting Chen , Wen-Kai Lin , Szu-Chi Yang , Shih-Hao Lin , Tsung-Hung Lee , Ming-Lung Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L27/092 ; H01L21/02 ; H01L21/8238

Abstract:
In an embodiment, a structure includes: a semiconductor substrate; a fin extending from the semiconductor substrate; a gate stack over the fin; an epitaxial source/drain region in the fin adjacent the gate stack; and a gate spacer disposed between the epitaxial source/drain region and the gate stack, the gate spacer including a plurality of silicon oxycarbonitride layers, each of the plurality of silicon oxycarbonitride layers having a different concentration of silicon, a different concentration of oxygen, a different concentration of carbon, and a different concentration of nitrogen.
Public/Granted literature
- US20210313441A1 Semiconductor Device and Method Public/Granted day:2021-10-07
Information query
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