- Patent Title: Trench field electrode termination structure for transistor devices
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Application No.: US16571712Application Date: 2019-09-16
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Publication No.: US11217690B2Publication Date: 2022-01-04
- Inventor: Ashita Mirchandani , Robert Haase , Tim Henson , Ling Ma , Niraj Ranjan
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/02 ; H01L21/311 ; H01L21/3213 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/40 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor device includes: a trench formed in a surface of a semiconductor substrate and extending lengthwise in a direction parallel to the surface; a body region adjoining the trench; a source region adjoining the trench above the body region; a drift region adjoining the trench below the body region; a field electrode in a lower part of the trench and separated from the substrate; and a gate electrode in an upper part of the trench and separated from the substrate and the field electrode. A first section of the field electrode is buried below the gate electrode in the trench. A second section of the field electrode transitions upward from the first section in a direction toward the surface. The separation between the second section and the gate electrode is greater than or equal to the separation between the first section and the gate electrode.
Public/Granted literature
- US20210083096A1 Trench Field Electrode Termination Structure for Transistor Devices Public/Granted day:2021-03-18
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