Disclosed is a field-effect transistor and a method for manufacturing a field-effect transistor. The method comprises: forming an NMOSFET region and a PMOSFET region on a substrate; forming a hard mask on the NMOSFET region and the PMOSFET region, and patterning through the hard mask; forming a multiple of stacked nanowires in the NMOSFET region and a multiple of stacked nanowires in the PMOSFET region; forming a first array of nanowires in the NMOSFET region and a second array of nanowires in the PMOSFET region; and forming an interfacial oxide layer, a ferroelectric layer, and a stacked metal gate in sequence around each of the nanowires included in the first array and the second array. Wherein the NMOSFET region and the PMOSFET region are separated by shallow trench isolation.