Invention Grant
- Patent Title: Semiconductor light emitting element and method of manufacturing semiconductor light emitting element
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Application No.: US16668335Application Date: 2019-10-30
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Publication No.: US11217728B2Publication Date: 2022-01-04
- Inventor: Noritaka Niwa , Tetsuhiko Inazu
- Applicant: NIKKISO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NIKKISO CO., LTD.
- Current Assignee: NIKKISO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JPJP2018-102460 20180529
- Main IPC: H01L33/46
- IPC: H01L33/46 ; H01L33/00 ; H01L33/14 ; H01L33/24 ; H01L33/32 ; H01L33/40

Abstract:
A semiconductor light emitting element includes: an n-type semiconductor layer provided on a substrate; an active layer provided in a first region of the n-type semiconductor layer and made of an AlGaN-based semiconductor material; a p-type semiconductor layer provided on the active layer; a first protective layer provided on the p-type semiconductor layer and made of silicon oxide (SiO2) or silicon oxynitride (SiON); a second protective layer provided to cover a top of the first protective layer, a second region on the n-type semiconductor layer different from the first region, and a lateral surface of the active layer and made of aluminum oxide (Al2O3), aluminum oxynitride (AlON), or aluminum nitride (AlN); a p-side electrode provided contiguously on the p-type semiconductor layer; and an n-side electrode provided contiguously on the n-type semiconductor layer.
Public/Granted literature
- US20200066941A1 SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT Public/Granted day:2020-02-27
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