Invention Grant
- Patent Title: Semiconductor substrate and method for producing same, substrate, and laminate
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Application No.: US16619447Application Date: 2018-06-07
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Publication No.: US11217739B2Publication Date: 2022-01-04
- Inventor: Ryo Teranishi , Shinji Munetoh , Osamu Furukimi
- Applicant: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- Applicant Address: JP Fukuoka
- Assignee: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- Current Assignee: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- Current Assignee Address: JP Fukuoka
- Agency: Studebaker & Brackett PC
- Priority: JPJP2017-114352 20170609
- International Application: PCT/JP2018/021877 WO 20180607
- International Announcement: WO2018/225823 WO 20181213
- Main IPC: H01L35/14
- IPC: H01L35/14 ; H01L35/20 ; H01L35/22 ; H01L35/34

Abstract:
A semiconductor substrate contains a clathrate compound of the following General Formula (I). The semiconductor substrate includes a variable-composition layer which includes a pn junction and where composition of the clathrate compound varies along a thickness direction. A rate of change in y in the thickness direction of at least a portion of the variable-composition layer is 1×10−4/μm or more. AxByC46-y (I) In General Formula (I), A represents at least one element selected from the group consisting of Ba, Na, Sr, and K, B represents at least one element selected from the group consisting of Au, Ag, Cu, Ni, and Al, and C represents at least one element selected from the group consisting of Si, Ge, and Sn, x is 7 to 9, and y is 3.5 to 6 or 11 to 17.
Public/Granted literature
- US20200161524A1 SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING SAME, SUBSTRATE, AND LAMINATE Public/Granted day:2020-05-21
Information query
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