Invention Grant
- Patent Title: Managing antenna module heat and RF emissions
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Application No.: US16751777Application Date: 2020-01-24
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Publication No.: US11217877B2Publication Date: 2022-01-04
- Inventor: Md Rashidul Islam , Chiya Saeidi , Yong-Ho Lim , Hugh K. Smith , Martin Rabindra Pais
- Applicant: Motorola Mobility LLC
- Applicant Address: US IL Chicago
- Assignee: Motorola Mobility LLC
- Current Assignee: Motorola Mobility LLC
- Current Assignee Address: US IL Chicago
- Agency: FIG. 1 Patents
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q21/24 ; H01Q1/22 ; H01Q1/02

Abstract:
In aspects of managing antenna module heat and RF emissions, an antenna module includes antenna elements that emit radio frequency (RF) signals for wireless data communication. The antenna module also includes an integrated heat sink to dissipate heat generated by an amplifier on the antenna module, where the heat sink is formed as a metallic component having a surface approximately coplanar with the antenna elements. The antenna module also includes one or more grooves that are formed into the surface of the heat sink, where the one or more grooves are effective to allow the RF signals being emitted from the antenna elements without deformation of a radiation pattern of the RF signals.
Public/Granted literature
- US20210234258A1 Managing Antenna Module Heat and RF Emissions Public/Granted day:2021-07-29
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