Invention Grant
- Patent Title: Antenna module
-
Application No.: US16902283Application Date: 2020-06-16
-
Publication No.: US11217887B2Publication Date: 2022-01-04
- Inventor: Chih-Cheng Li , Ssu-Han Ting
- Applicant: Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
- Applicant Address: CN Shanghai; TW Taipei
- Assignee: Inventec (Pudong) Technology Corporation,INVENTEC CORPORATION
- Current Assignee: Inventec (Pudong) Technology Corporation,INVENTEC CORPORATION
- Current Assignee Address: CN Shanghai; TW Taipei
- Agency: CKC & Partners Co., LLC
- Priority: CN202010490475.9 20200602
- Main IPC: H01Q1/48
- IPC: H01Q1/48 ; H01Q9/04

Abstract:
An antenna module includes a grounding plane, a first high-frequency radiator, a second high-frequency radiator, and a low-frequency grounding component. The first high-frequency radiator includes a first feeding portion, a first grounding portion, and a first radiating portion. The first grounding portion is coupled to the grounding plane. The second high-frequency radiator includes a second feeding portion, a second grounding portion, and a second radiating portion. The second grounding portion is coupled to the grounding plane. The low-frequency grounding component located between the first and second high-frequency radiators. The low-frequency grounding component includes a third grounding portion which is coupled to the grounding plane, a first coupling portion, and a second coupling portion. The low-frequency grounding component extends from the third grounding portion and extends in a first direction and a second direction of a first axis respectively to form the first and second coupling portions.
Public/Granted literature
- US20210376459A1 ANTENNA MODULE Public/Granted day:2021-12-02
Information query