Invention Grant
- Patent Title: Socket cover
-
Application No.: US16016378Application Date: 2018-06-22
-
Publication No.: US11217934B2Publication Date: 2022-01-04
- Inventor: Ming-Chen Chang , Mustafa H. Haswarey , Praneetha Kolla , Whitten Schulz
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H01R13/44
- IPC: H01R13/44 ; H01R13/52 ; H01R43/00 ; H01R12/70

Abstract:
Embodiments may relate to a cover for a socket of a computing device. The cover may include a cover piece and a locking mechanism attached to the cover piece by a hinge. The locking mechanism, when in a locked position, may removably secure the cover to a bolster such that the cover piece overlays the socket. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20190393643A1 SOCKET COVER Public/Granted day:2019-12-26
Information query