Invention Grant
- Patent Title: Electronic component unit
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Application No.: US16868760Application Date: 2020-05-07
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Publication No.: US11217945B2Publication Date: 2022-01-04
- Inventor: Yuya Kishibata
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2019-108138 20190610
- Main IPC: H01R13/66
- IPC: H01R13/66 ; H01R12/71 ; H01R13/502 ; H01R13/516 ; H05K3/34 ; H05K5/00 ; H05K1/18

Abstract:
An electronic component unit includes: a circuit board to mount an electronic component on the circuit board; a connector to receive and retain a terminal to be electrically connected to the circuit board; and a cover assembled to the connector and housing the circuit board. The circuit board is retained with the cover by using a beard retaining portion integrated with or separate from the cover. The connector has a cover retaining portion including a pair of protrusion portions. The cover retaining portion retains the cover assembled to the connector by holding a part of the cover between the pair of the protrusion portions.
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