Invention Grant
- Patent Title: Resin molded product and method for producing same
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Application No.: US16074112Application Date: 2017-02-07
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Publication No.: US11217957B2Publication Date: 2022-01-04
- Inventor: Kouji Sakakura , Yutaka Kobayashi
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Mie
- Agent Gerald E. Hespos; Matthew T. Hespos; Michael J. Porco
- Priority: JPJP2016-036775 20160229
- International Application: PCT/JP2017/004351 WO 20170207
- International Announcement: WO2017/150091 WO 20170908
- Main IPC: H01R43/24
- IPC: H01R43/24 ; H01R9/16 ; H01R9/24

Abstract:
A resin molded product is a terminal body 10 in which plate-like terminals 20 and a housing 40 made of synthetic resin are integrally fixed and includes bent portions 22 provided substantially at a right angle by press-working the terminals 20, molded portions 62 provided in the housing 40 to embed and cover inner curved surfaces 30 of the bent portions 22 obliquely from a lower-rear side, flat surface portions 32 provided in the form of flat surfaces on inner peripheral edge parts of side parts 22A of the bent portion 22 and disposed adjacent to the molded portions to be exposed from the molded portions, and thinned portions 34 made thinner than the flat surface portions 32 on the side parts 22A.
Public/Granted literature
- US20210104859A1 RESIN MOLDED PRODUCT AND METHOD FOR PRODUCING SAME Public/Granted day:2021-04-08
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