Invention Grant
- Patent Title: Wafer level coatings for photonic die
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Application No.: US16698853Application Date: 2019-11-27
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Publication No.: US11217963B1Publication Date: 2022-01-04
- Inventor: Murtaza Askari , Stephen B. Krasulick
- Applicant: Skorpios Technologies, Inc.
- Applicant Address: US NM Albuquerque
- Assignee: Skorpios Technologies, Inc.
- Current Assignee: Skorpios Technologies, Inc.
- Current Assignee Address: US NM Albuquerque
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01S5/028
- IPC: H01S5/028 ; G02B6/42 ; H01S5/02 ; H01S5/40

Abstract:
A photonic die includes an optical component that can emit output light. The optical component includes a substrate having a length and width that are substantially greater than a thickness thereof, the thickness defining a vertical direction. The optical component includes a vertical edge, and a reflective or antireflective coating on the vertical edge, wherein the reflective or antireflective coating includes a silicon-based material.
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