Invention Grant
- Patent Title: Impedance matching device and impedance matching method
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Application No.: US16719343Application Date: 2019-12-18
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Publication No.: US11218129B2Publication Date: 2022-01-04
- Inventor: Tatsuya Morii
- Applicant: DAIHEN Corporation
- Applicant Address: JP Osaka
- Assignee: DAIHEN Corporation
- Current Assignee: DAIHEN Corporation
- Current Assignee Address: JP Osaka
- Agency: Bozicevic, Field & Francis LLP
- Agent Rudy J. Ng; Bret E. Field
- Priority: JPJP2018-243191 20181226
- Main IPC: H03H7/38
- IPC: H03H7/38 ; H01J37/32

Abstract:
An impedance matching device 1 includes multiple capacitance elements and a control unit that controls on or off of semiconductor switches. The capacitance elements and respectively include a first capacitance element group and a second capacitance element group. The control unit updates the state of the first semiconductor switch included in the first capacitance element group with a first cycle until a predetermined time period elapses during which the state of the first semiconductor switch included in the first capacitance element group is maintained while the control unit updates the states of the semiconductor switch and respectively included in the first capacitance element group and the second capacitance element group with a second cycle longer than the first cycle after the predetermined time period elapses during which the state of the first semiconductor switch included in the first capacitance element group is maintained.
Public/Granted literature
- US20200212868A1 Impedance Matching Device and Impedance Matching Method Public/Granted day:2020-07-02
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