Invention Grant
- Patent Title: Image sensor package
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Application No.: US16786472Application Date: 2020-02-10
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Publication No.: US11218651B2Publication Date: 2022-01-04
- Inventor: In-Sang Song , Hyunsu Jun
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2019-0057286 20190516
- Main IPC: H04N5/33
- IPC: H04N5/33
Abstract:
An image sensor chip includes a substrate; an image sensor chip provided on the substrate; and an adhesive film provided between the image sensor chip and the substrate in a semi-cured state. A first width of the adhesive film is equal to a second width of the image sensor chip.
Information query
