Provided herein is a built-in speaker module. The built-in speaker module is installed in a housing of an electronic device having a first bottom surface spaced apart from a ground and a second bottom surface installed above the first bottom surface, and includes a speaker installed above the second bottom surface, a first vibration absorbing member interposed between the speaker and the second bottom surface, and a second vibration absorbing member interposed between the first bottom surface and the second bottom surface, wherein sound is emitted from the speaker through openings formed in the first bottom surface and the second bottom surface.