Invention Grant
- Patent Title: Method for providing an electrical connection and printed circuit board
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Application No.: US16844306Application Date: 2020-04-09
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Publication No.: US11219119B2Publication Date: 2022-01-04
- Inventor: Sylvia Ehrler
- Applicant: Advantest Corporation
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/18

Abstract:
Method for providing an electrical connection, comprising connecting a first cable to a first conducting structure on a printed circuit board, connecting a second cable to a second conducting structure on the printed circuit board, comparing a propagation delay of a first signal path comprising the first cable and the first conducting structure on the printed circuit board, and a propagation delay of a second signal path comprising the second cable and the second conducting structure on the printed circuit board; and removing conductive material of the first conducting structure and/or of the second conducting structure, in order to modify an electrical length of the first conducting structure and/or of the second conducting structure, to obtain a first conducting path and a second conducting path, in dependence on a result of the comparison, in order to reduce a difference of the propagation delays between the first signal path and the second signal path.
Public/Granted literature
- US20200288564A1 METHOD FOR PROVIDING AN ELECTRICAL CONNECTION AND PRINTED CIRCUIT BOARD Public/Granted day:2020-09-10
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