Invention Grant
- Patent Title: Circuit board assembly with electronic surface mount device and mount arrangement for thermal protection
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Application No.: US16737375Application Date: 2020-01-08
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Publication No.: US11219121B2Publication Date: 2022-01-04
- Inventor: Scott A. Peters
- Applicant: HONEYWELL INTERNATIONAL INC.
- Applicant Address: US NJ Morris Plains
- Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee Address: US NJ Morris Plains
- Agency: Lorenz & Kopf, LLP
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H05K1/02 ; H05K3/34 ; H01G2/06 ; H01G4/12 ; H01G4/228 ; H01L23/52
Abstract:
A circuit board assembly includes a circuit board, an electronic surface mount device (SMD), and a spacer that attaches the SMD to the circuit board. A coefficient of thermal expansion (CTE) of the spacer is closer to a CTE of the SMD than a CTE of the circuit board. The circuit board assembly also includes a flexible electrical lead that extends between and that is electrically connected to the SMD and the electrical node of the circuit board. Methods of manufacturing the circuit board assembly include selectively heating joining material at a predetermined heating rate and selectively cooling the joining material at a predetermined cooling rate to attach the flexible electrical leads to the SMD and the circuit board.
Public/Granted literature
- US20210212200A1 CIRCUIT BOARD ASSEMBLY WITH ELECTRONIC SURFACE MOUNT DEVICE AND MOUNT ARRANGEMENT FOR THERMAL PROTECTION Public/Granted day:2021-07-08
Information query
IPC分类:
