An electronic device and a power module are provided. The power module includes a power housing; a circuit board, connected to the power housing and arranged with a plurality of pads on a surface of the circuit board facing the power housing; an electronic component, arranged on the circuit board and comprising a plurality of pins; wherein the plurality of pins are soldered and connected to the plurality of pads; and a first sealant layer, arranged on the surface of the circuit board facing the power housing, and covering the plurality of pins and the plurality of pads.